Viet Nam National Multi-Project Wafer Coordination Center makes debut
VGP - The establishment of the Viet Nam National Multi-Project Wafer Coordination Center (VNMPW/CC), demonstrates the nation’s determination to building a complete semiconductor ecosystem, from design and pilot manufacturing to product commercialization.
The VNMPW/CC, headquartered in Ha Noi, is under the management of the Authority of Information Technology Application, the Ministry of Science and Technology.
The center is tasked with supporting agencies, organizations, and individuals in pilot semiconductor chip production by providing tools and software libraries for semiconductor chip design, offering technical support in the design stages, and organizing pilot production activities for semiconductor chips.
Meanwhile, it targets to train and develop human resources in the semiconductor field via organizing training courses and hands-on practice, and supporting universities in semiconductor chip design activities.
The center aims to support startups and commercialization of semiconductor chip products, connect with investment funds and national funding programs to support startups, and provide support for measurement, testing, and performance evaluation of semiconductor chips after pilot production.
It also focuses on developing the ecosystem and strengthening international linkages by building networks of agencies, organizations, and enterprises from countries with advanced semiconductor industries worldwide, sharing data and open technologies, encouraging the development of open semiconductor chip design libraries, and fostering a community for sharing chip design knowledge.
Viet Nam has a large-scale electronic manufacturing base, with hardware export turnover exceeding US$132 billion in 2024, along with a young and abundant workforce, including 1.9 million people working in technology sector and more than 7,000 chip design engineers.
The nation currently has more than 170 foreign direct investment projects in semiconductor sector with total capital of nearly US$11.6 billion, concentrating mainly in two stages, chip design and packaging and testing.
Around 60 design companies, eight packaging and testing projects, and more than 20 companies manufacturing and supplying materials and equipment are already present in the country./.
